|
|
Gas melting Quartz IngotGas-Melted Quartz Ingot - Technical Specifications Premium fused silica ingots manufactured via advanced gas-melting technology for high-purity applications in semiconductor, photovoltaic, and optical industries, ensuring superior thermal stability and minimal impurities13. Core Material Properties Ultra-High Purity: SiO₂ >99.99% with metallic impurities <0.1 ppm, meeting stringent industry standards for critical processes23. Thermal Resilience: Softening point at 1,730°C; continuous operation up to 1,250°C without degradation, ideal for high-temperature environments13. Optical Quality: Uniform transparency with >92% UV-VIS transmission (190-700 nm), minimizing scattering in precision optics3. Gas Melting Process Features Efficient Thermal Control: Utilizes gas-fueled burners for precise temperature management, optimizing energy efficiency and reducing melting time compared to conventional methods17. Heat distribution focuses on sidewalls to stabilize hot zones, enabling rapid phase transitions from solid to liquid states16. Process Optimization: Integrated computational models (e.g., FVM and SPH) monitor thermal fields, ensuring consistent ingot homogeneity and reducing defects like bubbles or cracks16. Scalable Production: Supports large-scale manufacturing with annual outputs exceeding 1,000 tons, guaranteeing batch-to-batch consistency23. Key Advantages Energy Efficiency: Lower operational costs due to optimized gas combustion, achieving up to 30% energy savings versus electric melting17. Chemical Inertness: Resists corrosion from acids, alkalis, and high-purity gases, maintaining integrity in reactive environments3. Minimal Contamination: Ion leaching levels ≤0.05 ppm, critical for semiconductor wafer fabrication and cleanroom applications23. Primary Applications Semiconductor Manufacturing: Base material for quartz components in diffusion furnaces and CVD reactors37. High-Temperature Processing: Used in molten salt systems, infrared heaters, and photovoltaic cell production lines13. Optical Devices: Precision substrates for laser optics and spectroscopic instruments3. Standard Specifications Parameter Value Dimensions Customizable: 100–500 mm diameter, 300–1000 mm length3 Surface Quality Fire-polished finish (Ra ≤0.5μm) or frosted for handling3 Thermal Shock ΔT ≥800°C (air-to-air) tolerance1 ⚠️ Critical Handling Guidelines Thermal Cycling: Limit heating/cooling rates to ≤10°C/min above 600°C to prevent stress fractures13. Storage: Maintain in nitrogen-purged containers to avoid surface contamination23. Safety: Avoid direct contact with alkaline cleaners; use semiconductor-grade solvents for cleaning3. Certified per ISO 9001 and RoHS/REACH compliance for global industrial use2
Collect
|
