|
|
Synthetic Quartz TubeSynthetic Quartz Tube - Technical Specifications Ultra-pure fused silica tubes manufactured via advanced vapor deposition technology for critical applications in semiconductor, fiber optics, and high-purity analytical systems, featuring exceptional chemical inertness and thermal stability15. Core Material Properties Ultra-High Purity Composition: SiO₂ >99.99% with metallic impurities <0.1 ppm, minimizing ionic contamination in sensitive processes510. Optical Performance: >92% UV-VIS transmission (190–700 nm) and low OH content (<5 ppm) for laser applications814. Thermal Resilience: Softening point 1,730°C; continuous operation up to 1,200°C without devitrification1114. Precision Geometry Parameter Specification Outer Diameter 1–300 mm ±0.05 mm tolerance18 Wall Thickness 0.5–20 mm ±0.1 mm1 Length ≤3,000 mm (customizable)8 Surface Finish Ra ≤0.5 μm (optical polish)58 Manufacturing Technology Gas-Phase Synthesis: Hydrolysis of SiCl₄ in hydrogen-oxygen flame, enabling nano-scale homogeneity and bubble-free structure1014. Defect Control: Strict process monitoring eliminates micro-cracks and inclusions for high-pressure/vacuum environments511. Key Advantages Chemical Resistance: Impervious to acids, halogens, and plasma erosion (e.g., HF, Cl₂)1114. Thermal Shock Tolerance: Withstands ΔT >800°C (air-to-air) for rapid thermal processing11. Electrical Insulation: Dielectric strength >25 kV/cm for semiconductor furnace components12. Primary Applications Semiconductor Fabrication: Diffusion furnace tubes for wafer processing1112. CVD reaction chambers and gas injectors18. Fiber Optics: Preform support sleeves for fiber drawing58. UV-curing sleeves for coating systems14. Analytical Instruments: High-temperature sample cells for ICP-MS/ICP-OES5. Quartz capillaries for chromatography5. ⚠️ Critical Handling Protocols Thermal Cycling: Limit ramp rates to ≤10°C/min above 600°C to prevent fracture1114. Cleaning: Use semiconductor-grade IPA or SC1 solution; alkaline cleaners prohibited1114. Installation: Avoid mechanical stress at flange connections; apply uniform torque ≤0.3 N·m8. Custom options include spiral structures, ITO coatings, and laser-etched markings814. Compliance: RoHS/REACH certified; meets SEMI F57 standards for semiconductor use
![]()
Collect
|