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Semiconductor Grade Quartz TubeSemiconductor Grade Quartz Tube - Technical Specifications Ultra-high purity fused silica tubes engineered for critical semiconductor fabrication processes, featuring exceptional chemical inertness, thermal stability, and strict compliance with industry standards12. Core Material Properties Ultra-High Purity Composition: SiO₂ >99.9995% with metallic impurities <0.1 ppm, minimizing ionic contamination during wafer processing25. Thermal Performance: Continuous operation at 1,200°C; softening point 1,730°C1. Optical Clarity: >92% UV-VIS transmission (190–700 nm) for process monitoring applications13. Precision Geometry Parameter Specification Outer Diameter 1–450 mm ±0.05 mm tolerance13 Wall Thickness 0.75–20 mm ±0.1 mm1 Length ≤3,000 mm (customizable)13 Surface Finish Optical polish (Ra ≤0.5 μm) or fire-polished13 Semiconductor-Specific Features Defect Control: Bubble-free structure with ≤0.05 ppm leachable ions, preventing wafer contamination25. Chemical Resistance: Resists HF, HCl, and plasma erosion in etching/diffusion processes15. Thermal Shock Tolerance: Withstands ΔT ≥800°C (air-to-air) for rapid thermal cycling1. Primary Applications Wafer Processing Equipment: Diffusion furnace tubes for 200 mm/300 mm晶圆 production lines5. CVD reactor liners and gas injectors12. Etching Systems: High-purity flanges and rings for corrosive environments2. Cleaning Modules: Solvent-resistant tubes for wet bench stations1. Customization Options Deep Processing: Laser cutting, bending, frosting, and end-fire sealing13. Special Designs: Spiral structures, flanged connections, and sandblasted markings23. ⚠️ Critical Handling Protocols Cleaning: Use semiconductor-grade IPA or SC1 solutions; strictly avoid alkaline cleaners15. Thermal Cycling: Limit ramp rates to ≤10°C/min above 600°C15. Storage: Nitrogen-purged containers to prevent surface adsorption2. Compliance: Meets SEMI F57 standards for semiconductor manufacturing5; RoHS/REACH certified23.
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