Customized Quartz Parts - Technical Specifications
Precision-engineered fused quartz components tailored for extreme environments in semiconductor, photonics, and industrial heating systems, featuring ultra-high purity and thermal resilience12.
Core Material Properties
Material Composition
Ultra-High Purity: SiO₂ >99.99% with metallic impurities <0.1 ppm2.
Thermal Performance: Continuous operation up to 1,200°C; softening point 1,730°C15.
Optical Clarity: >92% UV-VIS transmission (190-700 nm) for photonic applications5.
Customization Capabilities
Precision Machining:
Laser drilling for micro-hole patterns (e.g., gas distribution plates)5.
Tolerance control down to ±0.1 mm3.
Geometry Versatility:
Complex profiles: Sheets, rings, flanges, and heater-specific shapes13.
Thickness range: 0.5–50 mm with fire-polished or ground surfaces5.
Surface Treatments:
Primary Applications
Infrared Heating Systems:
Semiconductor Equipment:
Laser & Optical Devices:
Critical Specifications
| Parameter | Capability |
|---|
| Max. Dimensions | 500 mm diameter / 3000 mm length3 |
| Surface Finish | Ra ≤0.5μm (optical polish)3 |
| Thermal Shock ΔT | ≥800°C (air-to-air)1 |
⚠️ Handling Protocols
Cleaning: Semiconductor-grade solvents only; alkaline solutions prohibited5.
Thermal Cycling: Limit ramp rates to ≤10°C/min above 600°C1.
Storage: Nitrogen-purged containers to prevent contamination2.
Engineered per ISO 10110 optical standards with RoHS/REACH complianc
