Manufacturing

‌1. Core Material Properties‌

• ‌Ultra-High Purity‌: Synthetic quartz ingots achieve >99.9998% SiO₂ purity (≤0.1 ppm metal impurities), preventing contamination during wafer cleaning processes
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• ‌Controlled Hydroxyl Content‌: Adjustable OH⁻ levels (0.5–1,000 ppm) enhance chemical stability in acidic/alkaline cleaning agents
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• ‌Thermal Shock Resistance‌: Withstands rapid temperature cycles from 25°C to 1,200°C without cracking, critical for heated chemical baths
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‌2. Fabrication Process for Cleaning Tanks‌

1. ‌Ingot Processing‌:

• Cylindrical ingots (e.g., Φ150×100 mm or Φ300×50 mm) are sliced into plates/rods using diamond wire saws
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2. ‌High-Temperature Fusion‌:

• Components (plates/rods) are fused at 800–1,200°C in inert-gas furnaces, forming monolithic structures without adhesives
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3. ‌Precision Machining‌:

• Milling through-holes on quartz plates for chemical circulation, ensuring <5 μm dimensional accuracy
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‌3. Technical Advantages in Cleaning Systems‌

• ‌Corrosion Resistance‌:

• Maintains integrity in HF/H₂SO₄ solutions (erosion rate <0.1 μm/h), outperforming PVDF/NPP polymers
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• ‌Thermal Efficiency‌:

• Enables direct heating to 180°C+ via embedded heating elements, reducing energy loss by 25% vs. indirect heating
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• ‌Optical Transparency‌:

• Allows real-time UV monitoring of cleaning processes (transmission >90% at 254 nm)
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Key Performance Data

‌4. Industry Implementation‌

• ‌Wet Bench Cleaning Tanks‌:

• Replace polymer liners (e.g., PVDF) in immersion systems, extending service life 3× in concentrated acid environments
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• ‌Single-Wafer Spray Modules‌:

• Used in advanced nodes (<10 nm) where metal contamination must be <0.01 ppt
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Synthetic quartz ingots enable durable, contamination-free cleaning tanks essential for semiconductor precision manufacturing.